A SECRET WEAPON FOR MONOCRYSTALLINE SILICON

Wire-saw wafer slicing is one of the crucial generation systems for industrial crystalline silicon PV cells, and enhancements in wafer slicing technology have resulted in a discount in Uncooked wafer thickness from 370 μm to 180 μm since 1997 for Sharp industrial polycrystalline-silicon cells (Figure 6). To introduce wafers thinner than 150 μm,